PCF8531 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
PCF8531 Datasheet PDF : 51 Pages
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NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
Table 5. Bonding pad description …continued
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 2).
Symbol
Pad
X (μm) Y (μm) Description
T4
56
−1380.5 823.4
test input 4
[8]
VSS2
57
−1660.5 823.4
ground 2
[9]
VSS2
58
−1730.5 823.4
VSS2
59
−1800.5 823.4
VSS2
60
−1870.5 823.4
VSS2
61
−1940.5 823.4
VSS2
62
−2010.5 823.4
VSS2
63
−2080.5 823.4
VSS1
64
−2220.5 823.4
ground 1
[9]
VSS1
65
−2290.5 823.4
VSS1
66
−2360.5 823.4
VSS1
67
−2430.5 823.4
VSS1
68
−2500.5 823.4
VSS1
69
−2570.5 823.4
VSS1
70
−2640.5 823.4
T3
71
−2780.5 823.4
test 3
[8]
T1
72
−3060.5 823.4
test 1
[8]
SCL
73
−3410.5 823.4
serial clock line input of the I2C-bus
SCL
74
−3480.5 823.4
-
75
−3830.5 823.4
dummy
-
76
−4180.5 823.4
-
77
−4530.5 823.4
T2
78
−4600.5 823.4
test 2 output
[10]
-
79
−4880.5 823.4
dummy
-
80
−4950.5 823.4
-
81
−5230.5 823.4
-
82
−5300.5 823.4
-
83
−5650.5 823.4
-
84
−5720.5 823.4
-
85
−5930.5 823.4
-
86
−5926.4 −821.7
R0
87
−5786.4 −821.7 LCD row driver output
R2
88
−5716.4 −821.7
R4
89
−5646.4 −821.7
R6
90
−5576.4 −821.7
R8
91
−5506.4 −821.7
R10
92
−5436.4 −821.7
PCF8531
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 May 2011
© NXP B.V. 2011. All rights reserved.
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