PCF8582C View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
PCF8582C Datasheet PDF : 21 Pages
| |||
Philips Semiconductors
14. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
PCF8582C-2
256 × 8-bit CMOS EEPROM with I2C-bus interface
SOT97-1
D
L
Z
e
b
8
A2 A
A1
wM
b1
b2
5
pin 1 index
E
ME
c
(e 1)
MH
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
min. max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73 0.53 1.07 0.36
1.14 0.38 0.89 0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches 0.17
0.02
0.13
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT97-1
IEC
050G01
REFERENCES
JEDEC
JEITA
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 14. DIP8 package outline (SOT97-1).
9397 750 14222
Product data
Rev. 04 — 25 October 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
14 of 21
Share Link: 