RF2314PCBA-41X View Datasheet(PDF) - RF Micro Devices
Part Name
Description
Manufacturer
RF2314PCBA-41X Datasheet PDF : 12 Pages
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RF2314
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3μinch
to 8μinch Gold over 180μinch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
Pin 1
0.95 (mm)
Typ.
A = 0.70 x 1.00 (mm) Typ.
A
A
A
Pin 5
1.90 (mm)
Typ.
A
A
2.60 (mm)
Figure 1. PCB Metal Land Pattern (Top View)
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 3mil expansion to accommodate solder mask registration clearance around all pads. The center-
grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be pro-
vided in the master data or requested from the PCB fabrication supplier.
A = 0.90 x 1.20 (mm) Typ.
A
0.95 (mm)
Typ.
A
A
1.90 (mm)
Typ.
A
A
Figure 2. PCB Solder Mask Pattern (Top View)
2.60 (mm)
Rev A7 DS070730
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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