PCA82C251T View Datasheet(PDF) - Philips Electronics
Part Name
Description
Manufacturer
PCA82C251T Datasheet PDF : 24 Pages
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Philips Semiconductors
CAN transceiver for 24 V systems
Product specification
PCA82C251
BONDING PAD LOCATIONS
SYMBOL
TXD
GND
VCC
RXD
Vref
CANL
CANH
Rs
PAD
1
2
3
4
5
6
7
8
COORDINATES(1)
x
y
196
1080
1567
2 644
2 644
1 490
748
200
137
137
137
137
1 644
1 644
1 644
1 610
Note
1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (x/y = 0).
handbook, full pagewidth
8
7
6
5
1.78
PCA82C251U
mm
1
x
0
0
y
2
3
2.84 mm
Fig.10 Bonding pad locations.
4
MGL944
2000 Jan 13
11
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