TDA1308AT View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
TDA1308AT Datasheet PDF : 19 Pages
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NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
Table 1. Quick reference data …continued
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
Conditions
Min Typ Max
Ptot
total power
no load
dissipation
-
15 25
Po
maximum output (THD + N)/S < 0.1 %
[1] -
40 80
power
(THD + N)/S
total harmonic
distortion plus
noise-to-signal
ratio
S/N
signal-to-noise
ratio
RL = 5 kΩ
RL = 5 kΩ
RL = 5 kΩ
[1] -
[1] -
[2] -
[3] -
-
100
0.03 0.06
−70 −65
−92 −89
−52 −40
−101 -
110 -
αcs
PSRR
Tamb
channel
separation
power supply
ripple rejection
ambient
temperature
RL = 5 kΩ
fi = 100 Hz;
Vripple(p-p) = 100 mV
-
70 -
[1] -
105 -
-
90 -
−40 -
+85
Unit
mW
mW
%
dB
dB
dB
dB
dB
dB
dB
dB
°C
[1] VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).
[2] VDD = 2.4 V; VO(p-p) = 1.62 V (at −4.8 dBV); for TDA1308A only.
[3] VDD = 2.4 V; VO(p-p) = 1.19 V (at −7.96 dBV); for TDA1308A only.
4. Ordering information
Table 2. Ordering information
Type number Package
Name
Description
TDA1308
DIP8
plastic dual in-line package; 8 leads (300 mil)
TDA1308T SO8
plastic small outline package; 8 leads; body width
3.9 mm
TDA1308AT SO8
plastic small outline package; 8 leads; body width
3.9 mm
TDA1308AUK WLCSP8
wafer level chip-size package; 8 bumps;
0.61 × 0.84 × 0.38 mm
TDA1308TT TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm
Version
SOT97-1
SOT96-1
SOT96-1
TDA1308AUK
SOT505-1
TDA1308_A_4
Product data sheet
Rev. 04 — 25 January 2007
© NXP B.V. 2007. All rights reserved.
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