TZA1032 View Datasheet(PDF) - Philips Electronics

Part Name

Description

Manufacturer

TZA1032

Laser driver and controller circuit

Philips Electronics 

Philips Semiconductors

Laser driver and controller circuit

Preliminary specification

TZA1032

Bare die  All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for

a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be

separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips

Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die.

Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems

after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify

their application in which the die is used.

15 PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the

components in the I2C system provided the system conforms to the I2C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

2002 May 06

22

Share Link: