DATASHEET
4PIN DIP PHOTOTRANSISTOR PHOTOCOUPLER
EL817 series
Precautions for Use
1. Soldering Condition
1.1 (A) Maximum Body Case Temperature Profile for evaluation of Reflow Profile
Note:
Preheat
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate (Tsmax to Tp)
Other
Liquidus Temperature (TL)
Time above Liquidus Temperature (t L)
Peak Temperature (TP)
Time within 5 °C of Actual Peak Temperature: TP - 5°C
Ramp- Down Rate from Peak Temperature
Time 25°C to peak temperature
Reflow times
.
Reference: IPC/JEDEC J-STD-020D
150 °C
200°C
60-120 seconds
3 °C/second max
217 °C
60-100 sec
260°C
30 s
6°C /second max.
8 minutes max.
3 times
13 Copyright © 2010, Everlight All Rights Reserved. Release Date : May 21, 2013. Issue No: DPC-0000046 Rev.13
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