H11AV1ASM View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
H11AV1ASM Datasheet PDF : 10 Pages
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Package Dimensions
Through Hole
8.13–8.89
6
4
6.10–6.60
Pin 1 1
3
5.08 (Max.)
3.28–3.53
0.25–0.36
7.62 (Typ.)
0.4" Lead Spacing
8.13–8.89
6
4
6.10–6.60
Pin 1 1
3
5.08 (Max.)
3.28–3.53
0.25–0.36
0.38 (Min.)
(0.86)
1.02–1.78
2.54–3.81
2.54 (Bsc)
0.41–0.51
0.76–1.14
15° (Typ.)
0.20–0.30
0.38 (Min.)
(0.86)
1.02–1.78
2.54–3.81
2.54 (Bsc)
0.41–0.51
0.76–1.14
0.20–0.30
10.16–10.80
Surface Mount
8.13–8.89
6
4
6.10–6.60
8.43–9.90
(1.78)
(7.49)
(10.54)
(2.54)
(1.52)
1
3
Pin 1
0.25–0.36
3.28–3.53
5.08
(Max.)
0.38 (Min.)
(0.86)
1.02–1.78
2.54 (Bsc)
0.41–0.51
0.76–1.14
Note:
All dimensions in mm.
(0.76)
Rcommended Pad Layout
0.16–0.88
(8.13)
0.20–0.30
©2005 Fairchild Semiconductor Corporation
H11AV1M, H11AV1AM, H11AV2M, H11AV2AM Rev. 1.0.2
7
www.fairchildsemi.com
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