HI-201(1999) View Datasheet(PDF) - Intersil
Part Name
Description
Manufacturer
HI-201 Datasheet PDF : 10 Pages
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Die Characteristics
DIE DIMENSIONS:
54 mils x 79 mils
METALLIZATION:
Type: CuAl
Thickness: 16kÅ ±2kÅ
Metallization Mask Layout
GND
2
IN 2 3
HI-200
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 3.5kÅ ±1kÅ
Silox Thickness: 12kÅ ±2kÅ
WORST CASE CURRENT DENSITY:
2 x 105 A/cm2 at 25mA
HI-200
A2
A1
V+
1
10
9
8
IN 1
OUT 2
4
5
V-
9
6
7
OUT 1
VREF
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