74LVT16374ADGG View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
74LVT16374ADGG Datasheet PDF : 19 Pages
| |||
NXP Semiconductors
74LVT16374A; 74LVTH16374A
3.3 V 16-bit edge-triggered D-type flip-flop; 3-state
3. Ordering information
Table 1. Ordering information
Type number
Package
Temperature range Name
Description
74LVT16374ADL
−40 °C to +85 °C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
74LVT16374ADGG −40 °C to +85 °C
74LVTH16374ADGG
TSSOP48 plastic thin shrink small outline package;
48 leads; body width 6.1 mm
74LVT16374AEV
−40 °C to +85 °C
VFBGA56 plastic very thin fine-pitch ball grid array
package; 56 balls; body 4.5 × 7 × 0.65 mm
74LVTH16374ABQ −40 °C to +85 °C
HXQFN60U plastic thermal enhanced extremely thin quad
flat package; no leads; 60 terminals; UTLP
based; body 4 × 6 × 0.5 mm
Version
SOT370-1
SOT362-1
SOT702-1
SOT1134-1
4. Functional diagram
47 46 44 43 41 40 38 37
1D0 1D1 1D2 1D3 1D4 1D5 1D6 1D7
48 1CP
1 1OE
1Q0 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7
2 3 5 6 8 9 11 12
36 35 33 32 30 29 27 26
2D0 2D1 2D2 2D3 2D4 2D5 2D6 2D7
25 2CP
24 2OE
2Q0 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7
13 14 16 17 19 20 22 23
001aac369
Fig 1.
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
Logic symbol
1
1OE
1CP 48
24
2OE
25
2CP
1D0 47
46
1D1
1D2 44
43
1D3
41
1D4
40
1D5
38
1D6
1D7 37
36
2D0
35
2D1
33
2D2
32
2D3
2D4 30
29
2D5
27
2D6
26
2D7
EN1
C3
EN2
C4
3D
1
2 1Q0
3
1Q1
5 1Q2
6
1Q3
8
1Q4
9
1Q5
11
1Q6
12 1Q7
13
4D
2
2Q0
14
2Q1
16
2Q2
17
2Q3
19 2Q4
20
2Q5
22
2Q6
23
2Q7
001aaa254
Fig 2.
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
IEC logic symbol
74LVT_LVTH16374A_7
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 07 — 22 March 2010
© NXP B.V. 2010. All rights reserved.
2 of 19
Share Link: 