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GI821 View Datasheet(PDF) - General Semiconductor

Part Name
Description
Manufacturer
GI821
General
General Semiconductor 
GI821 Datasheet PDF : 2 Pages
1 2
RATINGS AND CHARACTERISTIC CURVES GI820 THRU GI828
FIG.1 - FORWARD CURRENT DERATING CURVE
7.0
6.0
Ipk/IAV=π
CAPACITIVE LOADS
5.0 I(pk)
10 I(AV)
5.0
20
4.0
3.0
2.0
1.0 1.1 x 1.1” (30 x 30mm)
COPPER PADS
0
20 40 60 80
100 120 140 160 180
AMBIENT TEMPERATURE, °C
FIG. 2 - FORWARD CURRENT DERATING CURVE
20
RESISTIVE OR INDUCTIVE LOAD
L= LEAD LENGTH
16
12
L=0.12”(3.2mm)
8.0
L=0.25”(6.3mm)
L=0.375”(9.5mm)
4.0 L=0.62”(15.9mm)
1.6” x 1.6” x 0.04”
(40mm x 40mm x 1mm)
COPPER HEATSINK
0
75 85 95 105 115 125 135 145 155 165 175
LEAD TEMPERATURE, °C
400
350
300
FIG. 3 - MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
TA=25°C
250
200
TJ=125°C
150
100
1
10
100
NUMBER OF CYCLES AT 60 Hz
100
10
FIG. 4 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
TJ=25°C
PULSE WIDTH=300µs
1% DUTY CYCLE
1
0.1
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG. 5 - TYPICAL REVERSE CHARACTERISTICS
10
TJ=100°C
1
TJ=50°C
0.1
TJ=25°C
0.01
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE, %
FIG. 6 - TYPICAL THERMAL RESISTANCE
25
L= LEAD LENGTH
20
15
10
5.0
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
EQUAL LEAD LENGTHS TO HEAT SINK, INCHES

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