HYB3118165BSJ-50 View Datasheet(PDF) - Siemens AG
Part Name
Description
Manufacturer
HYB3118165BSJ-50 Datasheet PDF : 24 Pages
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HYB 5118165BSJ/BST-50/-60
HYB 3118165BSJ/BST-50/-60
1M × 16 EDO-DRAM
Plastic Package P-TSOPII-50/44-1 (400 mil) (SMD)
(Plastic Thin Small Outline Package (Type II))
15˚±5˚
0.8
0.4
+0.05
-0.1
3)
15˚±5˚
24x 0.8 = 19.2
0.1 50x
0.2 M 50x
50
40 36
26
10.16±0.13 2)
0.5 ±0.1
11.76 ±0.2
1
11 15
25
2.5 max
20.95 ±0.13 1)
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max per side
2) Does not include plastic protrusion of 0.25 max per side
3) Does not include dambar protrusion of 0.13 max per side
GPX05958
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
Semiconductor Group
24
Dimensions in mm
1998-10-01
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