IRF6614PBF View Datasheet(PDF) - International Rectifier
Part Name
Description
Manufacturer
IRF6614PBF Datasheet PDF : 10 Pages
| |||
IRF6614PbF
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
TP
Peak Soldering Temperature
TJ
Operating Junction and
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
RθJA
el Junction-to-Ambient
RθJA
jl Junction-to-Ambient
RθJA
kl Junction-to-Ambient
RθJC
fl Junction-to-Case
RθJ-PCB
Junction-to-PCB Mounted
eà Linear Derating Factor
100
Max.
2.1
1.4
42
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.017
Max.
58
–––
–––
3.0
–––
Units
W
°C
Units
°C/W
W/°C
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
R1R1
R2R2
R3R3
R4R4
R5R5
Ri (°C/W) τi (sec)
τJ τJ
τCτ 0.6676 0.000066
τ1 τ1
τ2 τ2
τ3 τ3
τ4 τ4
τ5 τ5
1.0462 0.000896
Ci= τi/Ri
1.5611 0.004386
Ci= τi/Ri
29.282 0.68618
25.455 32
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
10
100
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
Surface mounted on 1 in. square Cu board, steady state.
Mounted on minimum footprint full size board with metalized
TC measured with thermocouple incontact with top (Drain) of part. back and with small clip heatsink.
Used double sided cooling, mounting pad with large heatsink.
Rθ is measured at TJ of approximately 90°C.
Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
Mounted to a PCB with
small clip heatsink (still air)
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
Share Link: 