MYSON
TECHNOLOGY
1.0 CONNECTION DIAGRAM
20
30
MTU420
10
Pad No. 1
69
40
50
60
2.0 PIN ASSIGNMENT
Pin Pin
X
Y
Pin Pin
X
Y
Pin Pin
X
Y
No. Name (um) (um) No. Name (um) (um) No. Name (um) (um)
1 VDD 4127 1311 25 M3 742.5 2770.5 49 SEG11 1712.5 125.5
2 VDD1 4110.5 1471 26 M4 582.5 2770.5 50 SEG12 1872.5 125.5
3 VDDO 4110.5 1631 27 TESTA 422.5 2770.5 51 SEG13 2032.5 125.5
4 VDD2 4078 1791 28 CUP1 109 2757 52 SEG14 2192.5 125.5
5 ALM 4127 2142.5 29 CUP2 109 2190 53 SEG15 2352.5 125.5
6 LIGHT 4127 2440.5 30 S2 154.5 1891 54 SEG16 2512.5 125.5
7
S4 4079.5 2700.5 31 S1 154.5 1725.5 55 SEG17 2672.5 125.5
8 S3 3919.5 2770.5 32 XTIN 154.5 1460.5 56 SEG18 2832.5 125.5
9 IOA1 3759.5 2770.5 33 XTOUT 154.5 1300.5 57 SEG19 2992.5 125.5
10 IOA2 3599.5 2770.5 34 CFIN 154.5 980.5 58 SEG20 3152.5 125.5
11 IOA3 3439.5 2770.5 35 CFOUT 154.5 1140.5 59 SEG21 3312.5 125.5
12 IAO4 3279.5 2770.5 36 COM1 133 730.5 60 SEG22 3472.5 125.5
13 IOB1 3119.5 2770.5 37 COM2 133 570.5 61 SEG23 3632.5 125.5
14 IOB2 2959.5 2770.5 38 COM3 133 410.5 62 SEG24 3792.5 125.5
15 IOB3 2799.5 2770.5 39 SEG1 112.5 125.5 63 SEG25 3952.5 125.5
16 IOB4 2639.5 2770.5 40 SEG2 272.5 125.5 64 SEG26 4112.5 225.5
17 RES 2479.5 2770.5 41 SEG3 432.5 125.5 65 COM4 4092 461
18 INT 1862.5 2770.5 42 SEG4 592.5 125.5 66 COM5 4092 621
19 P1 1702.5 2770.5 43 SEG5 752.5 125.5 67 COM6 4092 781
20 P2 1542.5 2770.5 44 SEG6 912.5 125.5 68 VDD3 4127 981
21 P3 1382.5 2770.5 45 SEG7 1072.5 125.5 69 GND 4127 1151
22 P4 1222.5 2770.5 46 SEG8 1232.5 125.5
23 M1 1062.5 2770.5 47 SEG9 1392.5 125.5
24 M2 902.5 2770.5 48 SEG10 1552.5 125.5
*Note: The substrate of die must connect to GND.
MTU420 Revision 2.9 02/17/1998
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