Features
◇ Glass passivated device
◇ Ideal for surface mouted applications
◇ Low leakage current
◇ Metallurgically bonded construction
Mechanical Data
◇ Case:JEDEC DO-213AB,molded plastic over
passivated chip
◇ Polarity: Color band denotes cathode end
◇ Weight: 0.0046 ounces, 0.116 gram
◇ Mounting position: Any
SM513-SM2000
Surface Mount Rectifiers
REVERSE VOLTAGE:1300-2000V
CURRENT: 1.0 A
DO - 213AB
SOLDERABLE ENDS
D2=D1
+0
-0.20
D2
0.5± 0.1
4.9± 0.2
0.5± 0.1
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase,half wave,60Hz,resistive or inductive load.For capactive load,derate current by 20%.
SM
SM
SM
513
516
518
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forword
rectified current TA=75℃
VRRM
VRMS
VDC
I(AV)
1300
910
1300
1600
1120
1600
1800
1260
1800
1.0
Peak forward surge current 8.3ms single
half-sine-wave superimposed
IFSM
40
on rated load (JEDEC method)
Maximum forward voltage at 1.0A
Maximum DC reverse current @TA=25℃
at rated DC blockjing voltage @TA=125℃
Typical junction capacitance (NOTE 1)
Typical thermal resistance (NOTE 2)
Typical thermal resistance (NOTE 3)
Operating temperature range
Storage temperature range
VF
IR
Cj
RjθL
RjθA
Tj
TSTG
1.1
5.0
50
15
20
50
- 55 --- + 175
- 55 --- + 175
NOTES:1. Measured at 1.0MHz and applied average voltage of 4.0V DC.
2. Thermal resistance junction to lead, 6.0 mm 2 coppeer pads to each terminal.
3. Thermal resistance junction to ambient, 6.0 mm 2 coppeer pads to each terminal.
SM
2000
2000
1400
2000
UNITS
V
V
V
A
A
V
μA
pF
℃/W
℃/W
℃
℃
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