IRF520VS/IRF520VL
Electrical Characteristics @ TJ = 25ยฐC (unless otherwise specified)
V(BR)DSS
โV(BR)DSS/โTJ
RDS(on)
VGS(th)
gfs
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
EAS
Single Pulse Avalanche Energyยย
Min. Typ. Max. Units
Conditions
100 โโโ โโโ V VGS = 0V, ID = 250ยตA
โโโ 0.12 โโโ V/ยฐC Reference to 25ยฐC, ID = 1mA ย
โโโ โโโ 0.165 โฆ VGS = 10V, ID = 5.5A ย
2.0 โโโ 4.0 V VDS = VGS, ID = 250ยตA
1.9 โโโ โโโ S VDS = 50V, ID = 5.5Aยย
โโโ โโโ 25 ยตA VDS = 100V, VGS = 0V
โโโ โโโ 250
VDS = 80V, VGS = 0V, TJ = 150ยฐC
โโโ โโโ 100 nA VGS = 20V
โโโ โโโ -100
VGS = -20V
โโโ โโโ 22
ID = 9.2A
โโโ โโโ 5.2
โโโ โโโ 7.0
nC VDS = 80V
VGS = 10V, See Fig. 6 and 13ย
โโโ 6.9 โโโ
VDD = 50V
โโโ 23 โโโ ns ID = 9.2A
โโโ 30 โโโ
RG = 18โฆ
โโโ 24 โโโ
VGS = 10V, See Fig. 10 ยย
Between lead,
D
โโโ 4.5 โโโ
6mm (0.25in.)
nH
from package
G
โโโ 7.5 โโโ
and center of die contact
S
โโโ 560 โโโ
VGS = 0V
โโโ 81 โโโ
VDS = 25V
โโโ 10 โโโ pF ฦ = 1.0MHz, See Fig. 5 ย
โโโ 150ย
44ย mJ IAS = 9.2A, L = 1.0mH
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)ย
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
โโโ โโโ 9.6
A showing the
integral reverse
G
โโโ โโโ 37
p-n junction diode.
S
โโโ โโโ 1.2 V TJ = 25ยฐC, IS = 9.2A, VGS = 0V ย
โโโ 83 120 ns TJ = 25ยฐC, IF = 9.2A
โโโ 220 330 nC di/dt = 100A/ยตs ยย
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
ย Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
ย Starting TJ = 25ยฐC, L = 1.0mH
RG = 25โฆ, IAS = 9.2A, VGS=10V (See Figure 12)
ย ISD โค 9.2A, di/dt โค 360A/ยตs, VDD โค V(BR)DSS,
TJ โค 175ยฐC
ย Pulse width โค 400ยตs; duty cycle โค 2%.
ย
This is a typical value at device destruction and represents
operation outside rated limits.
ย This is a calculated value limited to TJ = 175ยฐC .
ย Uses IRF520V data and test conditions.
**When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to
application note #AN-994
2
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