Chip Resistor Surface Mount
Product specification 7
SR SERIES 0402/0603/0805/1206/1210/1218/2010/2512
8
TEST
Solderability
- Wetting
TEST METHOD
J-STD-002
Board Flex
IEC 60115-1 4.33
PROCEDURE
REQUIREMENTS
Electrical Test not required Magnification 50X
SMD conditions:
Immerse the specimen into the solder pot at
245± 3°C for 2± 0.5 seconds.
Well tinned (≥95% covered)
No visible damage
Chips mounted on a 90mm glass epoxy resin
PCB (FR4)
Bending for 0402: 5mm
0603 & 0805: 3mm
1206 and above: 2mm
Holding time: minimum 60 seconds
± (1.0%+0.05 Ω)
Nov. 11, 2016 V.5
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