ML145407 View Datasheet(PDF) - LANSDALE Semiconductor Inc.
Part Name
Description
Manufacturer
ML145407 Datasheet PDF : 8 Pages
| |||
ML145407
LANSDALE Semiconductor, Inc.
-A-
20
1
-T-
SEATING
PLANE
E
G
F
OUTLINE DIMENSIONS
P DIP 20 = RP
(ML145407RP)
PLASTIC DIP
CASE 738–03
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
L
FLASH.
M
J 20 PL
0.25 (0.010) M T B M
INCHES
MILLIMETERS
DIM
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E
0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G
0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M
0° 15° 0°
15°
N 0.020 0.040 0.51 1.01
–A–
20
11
SOG 20 = -6P
(ML145407-6P)
SOG PACKAGE
CASE 751D–04
–B– 10X P
0.010 (0.25) M B M
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
20X D
J
0.010 (0.25) M T A S B S
F
18X G
C
–T–
SEATING
PLANE
M
K
R X 45
DIM MIN MAX
A 12.65 12.95
B 7.40 7.60
C 2.35 2.65
D 0.35 0.49
F 0.50 0.90
G
1.27 BSC
J 0.25 0.32
K 0.10 0.25
M
0
7
P 10.05 10.55
R 0.25 0.75
MIN MAX
0.499 0.510
0.292 0.299
0.093 0.104
0.014 0.019
0.020 0.035
0.050 BSC
0.010 0.012
0.004 0.009
0
7
0.395 0.415
0.010 0.029
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabil-
ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-
tomer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
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