PGB2010402 View Datasheet(PDF) - Unspecified
Part Name
Description
Manufacturer
PGB2010402 Datasheet PDF : 4 Pages
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PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
Physical Specifications
Materials
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Device Weight 0.258 mg
Solderability MIL-STD-202, Method 208
Soldering
Parameters
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3FnPXTPMEFS¡$TFDPOETNBYJNVN
Design Consideration
Because of the fast rise-time of the ESD transient, proper
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consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard
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directly behind the connector so that they are the first board-
level circuit component encountered by the ESD transient.
Environmental Specifications
Operating Temperature
Biased Humity:
Biased Heat:
Thermal Shock
-65°C to +125°C
40°C, 95% RH, 1000 hours
85°C, 85% RH, 1000 hours
MIL-STD-202, Method 107G,
-65°C to 125°C, 30 min. cycle,
10 cycles
Vibration
MIL-STD-202, Method 201A
Chemical Resistance
MIL-STD-202, Method 215
Solder Leach Resistance and
Terminal Adhesion
*1$&*"+45%
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
150°C
200°C
60 – 180 seconds
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217°C
60 – 150 seconds
260°C
10 – 30 seconds
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Notes:
- PGB2 Series recommended for reflow soldering only
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- For recommended soldering pad layout dimensions,
please refer to Dimensions section of this data sheet
PGB2 Series
Specifications are subject to change without notice.
3
Revised: December 8, 2008
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©2008 Littelfuse
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