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TEF6621 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
TEF6621 Datasheet PDF : 2 Pages
1 2
as well as the expensive external components needed for LNA
and AGC in the AM and FM front-ends. The TEF662x family
also integrates a VCO, so there’s no need for external LC tank
components.
The low-IF architecture simplifies PCB layout, since there
aren’t any critical high-frequency lines and there’s no need
for alignments. Even designers with limited RF know-how
or resources can design the TEF662x onto the main PCB
board, saving significant costs by making a tuner module
design obsolete. Manufacturing is also easier, since full SMD
applications, without hand mounting, are possible. Production
throughput can be higher, too, because there are fewer small
external components to handle, and there are no mechanical
or software alignments to be made.
Space savings delivered by TEF662x devices
TEF662x block and low-cost application diagram
IFT
10.7 MHz
IFT
CER
FM
RF
100 MHz
FM
RF
IC
240 MHz
VCO
Conventional
Tuner Module
IC
100 MHz
4 MHz
brb546
Tiger main board `
application
TEF662x selection guide
Type number
System
R(B)DS
FM
AM
General
Power supply
Output
PACS
Demodulator / decoder
Japan / EU / US bands
OIRT
NB
Stereo decoder
Weak signal handling
LW / MW
SW
Weak signal handling
Package
Tamb
Automotive
Product release
TEF6621
8.5 V
L/R, MPX
-
-/-
-
-
SO32
-20 to 85 °C
No
Available
TEF6623
8.5 V
L/R, MPX, RDS
•/-
-
-
-
SO32
-20 to 85 °C
No
Available
TEF6624
8.5 V
L/R, MPX, RDS
•/-
-
SO32
-20 to 85 °C
No
Available
www.nxp.com
© 2010 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release : December 2010
Document order number : 9397 750 16995
Printed in the Netherlands

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