NXP Semiconductors
1PS76SB10
Schottky barrier single diode
13. Soldering
3.05
2.1
1.65 0.95
0.5 (2×) 0.6 (2×)
2.2
0.5
(2×)
0.6
(2×)
Fig. 5. Reflow soldering footprint for SOD323
5
2.9
1.5 (2×)
2.75
1.2
(2×)
Fig. 6. Wave soldering footprint for SOD323
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod323_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sod323_fw
14. Revision history
Table 8. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
1PS76SB10 v.4
20121217
Product data sheet
-
1PS76SB10 v.3
Modifications:
• Section "Features and benefits" updated
• Section "Applications" updated
• Table 5 "Limiting values": ambient temperature Tamb minimum value updated
• Table 7 "Characteristics": forward voltage VF conditions updated
• Figures 1, 2 and 3 updated
1PS76SB10 v.3
20120718
Product data sheet
-
1PS76SB10 v.2
1PS76SB10 v.2
20040126
Product specification -
1PS76SB10 v.1
1PS76SB10 v.1
19961014
Product specification -
-
1PS76SB10
Product data sheet
All information provided in this document is subject to legal disclaimers.
17 December 2012
© NXP B.V. 2012. All rights reserved
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