NXP Semiconductors
74AHC2G125; 74AHCT2G125
Dual buffer/line driver; 3-state
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
y
Z
8
5
pin 1 index
E
c
HE
A A2
A1
1
e
4
bp
wM
detail X
A
X
vM A
Q
(A3)
θ
Lp
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT765-1
REFERENCES
JEDEC
JEITA
MO-187
L
Lp
Q
v
w
y
Z(1)
θ
0.4
0.40 0.21
0.15 0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
Fig 10. Package outline SOT765-1 (VSSOP8)
74AHC_AHCT2G125_2
Product data sheet
Rev. 02 — 22 December 2008
© NXP B.V. 2008. All rights reserved.
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