AD5694ARUZ-RL7 View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

AD5694ARUZ-RL7

Quad, 16-/12-Bit nanoDAC+ with I2C Interface

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 5.

Parameter

VDD to GND

VLOGIC to GND

VOUT to GND

VREF to GND

Digital Input Voltage to GND1

SDA and SCL to GND

Operating Temperature Range

Storage Temperature Range

Junction Temperature

Reflow Soldering Peak Temperature,

Pb Free (J-STD-020)

ESD

Human Body Model (HBM)

Field-Induced Charged Device

Model (FICDM)

Rating

−0.3 V to +7 V

−0.3 V to +7 V

−0.3 V to VDD + 0.3 V

−0.3 V to VDD + 0.3 V

−0.3 V to VLOGIC + 0.3 V

−0.3 V to +7 V

−40°C to +105°C

−65°C to +150°C

125°C

260°C

3.5 kV

1.5 kV

1 Excluding SDA and SCL.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

AD5696/AD5694

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages. This

value was measured using a JEDEC standard 4-layer board with

zero airflow. For the LFCSP package, the exposed pad must be

tied to GND.

Table 6. Thermal Resistance

Package Type

θJA

16-Lead LFCSP

70

16-Lead TSSOP

112.6

Unit

°C/W

°C/W

ESD CAUTION

Rev. A | Page 7 of 24

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