UPD78C12AGQ-XXX-36 View Datasheet(PDF) - NEC => Renesas Technology

Part Name

Description

Manufacturer

UPD78C12AGQ-XXX-36

8-BIT SINGLE-CHIP MICROCOMPUTER (WITH A/D CONVERTER)

NEC => Renesas Technology 

µPD78C10A, 78C11A, 78C12A

Table 10-2 Inserted Type Soldering Conditions

(1) µPD78C10ACW

µPD78C11ACW-×××

µPD78C12ACW-×××

µPD78C10AGQ-36

µPD78C11AGQ-×××-36

µPD78C12AGQ-×××-36

: 64-pin plastic shrink DIP (750 mil)

: 64-pin plastic shrink DIP (750 mil)

: 64-pin plastic shrink DIP (750 mil)

: 64-pin plastic QUIP

: 64-pin plastic QUIP

: 64-pin plastic QUIP

Soldering Method

Wave soldering

(pin only)

Pin part heating

Soldering Conditions

Solder bath temperature: 260 °C max.

Duration: 10 sec. max.

Pin temperature: 300 °C max.

Duration: 3 sec. max. (per pin)

Caution Ensure that the application of wave soldering is limited to

the pins and no solder touches the main unit directly.

(2) µPD78C11AGQ-×××-37 : 64-pin plastic QUIP straight

µPD78C12AGQ-×××-37 : 64-pin plastic QUIP straight

Soldering Method

Pin part heating

Soldering Conditions

Pin temperature: 300 °C max.

Duration: 3 sec. max. (per pin)

61

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