Product Specification
SL1 ICS31 01
Rev. 1.2
11 HANDLING RECOMMENDATIONS
14
11.1 Sawing .................................................................................................................................. 14
11.2 Die Attach............................................................................................................................. 14
11.3 Wire Bonding....................................................................................................................... 14
12 COIL SPECIFICATION
14
13 ELECTRICAL SPECIFICATIONS
15
14 HINTS FOR LABEL IC ENCAPSULATION
16
14.1 Protection against Visible Light......................................................................................... 16
14.2 Protection against UV Light............................................................................................... 16
14.3 Resistance to X-Rays .......................................................................................................... 16
15 INLET/LABEL CHARACTERISATION AND TEST
17
15.1 Characterisation of the Inlet/Label ................................................................................... 17
15.2 Final Test of the Inlet/Label............................................................................................... 17
16 APPENDIX A: DIE PLAN
18
17 APPENDIX B: CLUSTER PLAN
19
18 APPENDIX C: CLUSTER MAP
20
19 APPENDIX D: WAFER MAP
21
July 2000
Page 3 of 22
Public