AO4800L View Datasheet(PDF) - Alpha and Omega Semiconductor
Part Name
Description
Manufacturer
AO4800L Datasheet PDF : 5 Pages
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II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Filler % (Spherical/Flake)
Flammability Rating
Backside Metallization
Moisture Level
AO4800
AO4800L (Green Compound)
Standard sub-micron
Standard sub-micron
low voltage N channel process low voltage N channel process
8 leads SOIC
8 leads SOIC
Copper with Solder Plate
Copper with Solder Plate
Ag epoxy
Ag epoxy
Au 2mils
Au 2 mils
Epoxy resin with silica filler Epoxy resin with silica filler
50/50
100/0
UL-94 V-0
UL-94 V-0
Ti / Ni / Ag
Ti / Ni / Ag
Up to Level 1 *
Up to Level 1*
Note * based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO4800 (Standard) & AO4800L (Green)
Test Item
Test Condition
Time
Point
Solder
Reflow
Precondition
HTGB
Normal: 1hr PCT+3
cycle IR reflow@240℃
(260℃ for Green)
Temp = 150 C,
Vgs=100% of Vgsmax
0hr
168 / 500
hrs
1000 hrs
HTRB
Temp = 150 C, Vds=80% 168 / 500
of Vdsmax
hrs
HAST
130 +/- 2 C, 85%, 33.3
psi, Vgs = 80% of Vgs
max
1000 hrs
100 hrs
Pressure Pot 121 C, 15+/-1 PSIG,
RH=100%
96 hrs
Temperature -65 to 150 deg C, air to
Cycle
air, 0.5hr per cycle
250 / 500
cycles
Lot Attribution
Normal: 81 lots
Green: 23 lots
Normal: 3 lots
(Note A*)
Normal: 3 lots
(Note A*)
Normal: 52 lots
Green: 16 lots
(Note B**)
Normal: 70 lots
Green: 20 lots
(Note B**)
Normal: 81 lots
Green: 23 lots
(Note B**)
Total
Sample
size
14410 pcs
246 pcs
77+5 pcs /
lot
246 pcs
77+5 pcs /
lot
3740 pcs
50+5 pcs /
lot
4950 pcs
50+5 pcs /
lot
5720 pcs
50+5 pcs /
lot
Number
of
Failures
0
0
0
0
0
0
3
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