MA44700 Series
Surface Mount Low Power Step Recovery Diodes
Mounting Information
The illustration indicates the recommended mount-
ing pad configuration for the SOT-23 and SC-79
packages. Solder paste containing flux should be
screened onto the pads to a thickness of 0.005-
0.007 inches. The plastic package is placed in posi-
tion, firmly adhering to the solder paste.
Permanent attachment is performed by a reflow sol-
dering procedure during which the tab temperature
does not exceed +275 °C and the body temperature
does not exceed +250 °C, for standard models and
+260 °C for the RoHS compliant devices.
Please refer to Application Note M538 for surface
mounting instructions.
SOT-23
.035 min.
0.90
SC-79
Rev. V5
.030 min.
0.80
.090
2.2
.037
0.95
0.75
1.9
Dimenstions: inches
mm
0.020
0.50
Package Configuration
SOT-23 (Case Style 287)
0.020
0.50
0.053
1.35
Dimenstions: inches
mm
SC-79 (Case Style 1279)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.