MAX11040EVKIT View Datasheet(PDF) - Maxim Integrated

Part Name

Description

Manufacturer

MAX11040EVKIT

MAX11040 Evaluation Kit/Daughterboard

Maxim Integrated 

MAX11040 Evaluation Kit/Daughterboard

Cascade

Carefully connect the boards by aligning the EV kit’s

14-pin connector (J12) with the 14-pin header (J1) of

the daughterboard. Gently press them together. The

two boards should be flush against each other. If more

daughterboards need to be cascaded to the EV kit,

connect the 14-pin connector (J2) of the last daughter-

board with the 14-pin header (J1) of the additional

daughterboard.

Place the shunt on pins 2-3 of JU3 on the last daughter-

board (the one farthest away from the EV kit board),

and place the shunt on pins 1-2 of JU3 on all other

boards (including the EV kit board).

Power Supply

Two separate power supplies are required to power up

the daughterboard. Connect the analog voltage supply

(from +3V to +3.6V) and the analog ground to the

AVDD and AGND connectors, respectively. Connect

the digital voltage supply (from +2.7V to AVDD) and the

digital ground to the DVDD and DGND connectors on

the daughterboard, respectively.

LEDs

There are four LED indicators (D1–D4) on the daughter-

board. D1 and D2 LEDs reflect the real-time logic levels

on the FAULT and the OVRFLW pins, respectively. D3

and D4 LEDs latch on the fault conditions on the FAULT

and the OVRFLW pins, respectively. When D3 or D4 is

turned on, press the Clear LED button in the EV kit soft-

ware (Figure 1) or press the on-board pushbutton (S2)

to turn off the LEDs after the faults are cleared. All IC

FAULT and OVERFLW pins are open drain and respec-

tively connected in a wired-ORed configuration.

Table 2. Jumper Settings (Daughterboard)

JUMPER

JU1

JU2

JU3

JU4

SHUNT

POSITION

1-2

Open*

1-2

Open*

1-2

2-3*

DESCRIPTION

Connects the on-board crystal (Y1) to the crystal

oscillator input and output of the IC (U1)

Disconnects the on-board crystal from the IC

(U1)

Connects the XOUT pin of the IC (U1) to the

EX_XOUT pad

Disconnects the EX_XOUT pad from the XOUT

pin of the IC (U1)

Connects the DRDYOUT pin of the IC (U1) to the

CO_DRDYOUT pin on the connector (J2)

Connects the DRDYOUT pin of the IC (U1) to the

interrupt pin (INT0) of the on-board controller

WHEN TO USE THIS OPTION

When the user wishes to stimulate the IC

modulator clock by the on-board crystal (Y1)

When the user does not wish to stimulate the IC

(U1) modulator clock by the on-board crystal

(Y1)

When the user-supplied external crystal

connects to the IC (U1) through the EX_XIN and

the EX_XOUT pads

When an external crystal is not used

Use this option when more IC daughterboards

need to be cascaded

Use this option on the last IC daughterboard that

cascades to the IC EV kit

1-2*

Connects the XIN pin of the IC (U1) to the CI_XIN

pin on the J1 connector

Note: CI_XIN carries the CLKOUT signal from the

previous cascaded board

When the user wishes to stimulate the IC (U1)

modulator clock by the CLKOUT of the previous

cascaded board

Connects the XIN pin of the IC (U1) to the

EX_XIN pad

When the user does not wish to stimulate the IC

2-3

Note: User-supplied external crystal may be

(U1) modulator clock by the CLKOUT of the

connected to the IC (U1) through the EX_XIN and previous cascaded board

the EX_XOUT pads

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