SY100E112JI View Datasheet(PDF) - Micrel
Part Name
Description
Manufacturer
SY100E112JI Datasheet PDF : 4 Pages
| |||
Micrel, Inc.
TRUTH TABLE
EN
Qn
Qn
L
Dn
Dn
H
H
L
SY10E112
SY100E112
DC ELECTRICAL CHARACTERISTICS
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
Symbol
Parameter
TA = –40°C
TA = 0°C
TA = +25°C
TA = +85°C
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
IIH
Input HIGH Current
EN
D
µA
— — 150 — — 150 — — 150 — — 150
— — 200 — — 200 — — 200 — — 200
IEE
Power Supply Current
mA
10E — 47 56 — 47 56 — 47 56 — 47 56
100E — 47 56 — 47 56 — 47 56 — 54 65
AC ELECTRICAL CHARACTERISTICS
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
Symbol
Parameter
TA = –40°C
TA = 0°C
TA = +25°C
TA = +85°C
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
tPD
Propagation Delay to Output
ps
D
200 400 600 200 400 600 200 400 600 200 400 600
EN
275 450 675 275 450 675 275 450 675 275 450 675
tskew
Within-Device Skew
Dn to Qn, Qn(1)
Qna to Qnb(2)
ps
— 80 — — 80 — — 80 — — 80 —
— 40 — — 40 — — 40 — — 40 —
tr
Rise/Fall Time
tf
20% to 80%
275 425 700 275 425 700 275 425 700 275 425 700 ps
Notes:
1. Within-device skew is defined as identical transitions on similar paths through a device.
2. Skew defined between common OR or common NOR outputs of a single gate.
M9999-032006
hbwhelp@micrel.com or (408) 955-1690
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