BSP60 View Datasheet(PDF) - Philips Electronics
Part Name
Description
Manufacturer
BSP60 Datasheet PDF : 8 Pages
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Philips Semiconductors
PNP Darlington transistors
Product specification
BSP60; BSP61; BSP62
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
Rth j-s
thermal resistance from junction to ambient
thermal resistance from junction to solder point
note 1
98
K/W
17
K/W
Note
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see “Thermal considerations for the SOT223 in the General Part of associated
Handbook”.
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
ICES
IEBO
hFE
VCEsat
VBEsat
fT
collector cut-off current
BSP60
BSP61
BSP62
emitter cut-off current
DC current gain
collector-emitter saturation
voltage
base-emitter saturation voltage
transition frequency
VBE = 0; VCE = −45 V
VBE = 0; VCE = −60 V
VBE = 0; VCE = −80 V
IC = 0; VEB = −4 V
VCE = −10 V; note 1; see Fig.2
IC = −150 mA
IC = −500 mA
IC = −500 mA; IB = −0.5 mA
IC = −500 mA; IB = −0.5 mA;
Tj = 150 °C
IC = −500 mA; IB = −0.5 mA
IC = −500 mA; VCE = −5 V;
f = 100 MHz
Switching times (between 10% and 90% levels); see Fig.3
ton
turn-on time
toff
turn-off time
ICon = −500 mA; IBon = −0.5 mA;
IBoff = 0.5 mA
Note
1. Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
MIN. TYP. MAX. UNIT
−
−
−50 nA
−
−
−50 nA
−
−
−50 nA
−
−
−50 nA
1000 −
2000 −
−
−
−
−
−
−
−1.3 V
−1.3 V
−
−
−1.9 V
−
200 −
MHz
−
400 −
ns
−
1500 −
ns
1999 Apr 29
3
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