AD7740(2000) View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD7740 Datasheet PDF : 11 Pages
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AD7740
TIMING CHARACTERISTICS1, 2, 3 (VDD = 3.0 V to 3.6 V, 4.75 V to 5.25 V, GND = O V, REFIN = 2.5 V)
Parameter
Limit at TMIN, TMAX
VDD = 3.0 V to 3.6 V
Limit at TMIN, TMAX
VDD = 4.75 V to 5.25 V
Unit
Conditions/Comments
fCLKIN
tHIGH:tLOW
t1
t2
t3
t4
32
1
40:60
60:40
50
2.3
1.6
tHIGH ± 20
32
1
40:60
60:40
35
1.8
1.4
tHIGH ± 8
kHz min
MHz max
min
max
ns typ
ns typ
ns typ
ns typ
Clock Frequency
Clock Mark/Space Ratio
CLKIN Edge to FOUT Edge Delay
FOUT Rise Time
FOUT Fall Time
FOUT Pulsewidth
NOTES
1Guaranteed by design and characterization, not production tested.
2All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (V IL + VIH)/2.
3See Figure 1.
Specifications subject to change without notice
t HIGH
CLKIN
FOUT
t4
t1
t LOW
t2
t3
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS*
(TA = 25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to GND . . . . . –0.3 V to VDD + 0.3 V
Logic Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
FOUT Voltage to GND . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (K Version) . . . . . . . . . . . . . . . . 0°C to +85°C
Automotive (Y Version) . . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . . 150°C
SOT-23 Package
Power Dissipation . . . . . . . . . . . . . . . . . . (TJ Max – TA)/θJA
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 240°C/W
Lead Temperature (10 secs) . . . . . . . . . . . . . . . . . . 300°C
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . 220 + 5/0°C
Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec
microSOIC Package
Power Dissipation . . . . . . . . . . . . . . . . . (TJ Max – TA)/θJA
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
Lead Temperature (10 secs) . . . . . . . . . . . . . . . . . . . 300°C
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . 220 +5/0°C
Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7740 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. 0
–3–
WARNING!
ESD SENSITIVE DEVICE
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