AD8605/AD8606/AD8608
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
All Packages
Operating Temperature Range
All Packages
Junction Temperature Range
All Packages
Lead Temperature (Soldering, 60 sec)
Rating
6V
GND to VS
6V
Observe Derating Curves
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
Table 4.
Package Type
θJA1
θJC
Unit
5-Ball WLCSP (CB)
170
°C/W
5-Lead SOT-23 (RJ)
240
92
°C/W
8-Ball WLCSP (CB)
115
°C/W
8-Lead MSOP (RM)
206
44
°C/W
8-Lead SOIC_N (R)
157
56
°C/W
14-Lead SOIC_N (R)
105
36
°C/W
14-Lead TSSOP (RU)
148
23
°C/W
1 θJA is specified for the worst-case conditions, that is, a device soldered in a
circuit board for surface-mount packages.
ESD CAUTION
Rev. O | Page 8 of 24