SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0745, Rev. -
Electrical Characteristics:
Characteristics
Symbol
Max. Forward Voltage Drop
VF1
(per leg) *
VF2
Max. Reverse Current (per
IR1
leg) *
IR2
Max. Junction Capacitance
CT
(per leg)
Typical Series Inductance
LS
(per leg)
Max. Voltage Rate of Change dv/dt
* Pulse Width < 300µs, Duty Cycle <2%
Measured lead to lead 5 mm from package body
Condition
@ 30A, Pulse, TJ = 25℃
@ 30 A, Pulse, TJ = 125℃
@VR = rated VDC ,TJ = 25℃
@VR = rated VDC ,TJ = 125℃
@VR = 5V, TC = 25℃
fSIG = 1MHz
Measured lead to lead 5 mm
from package body
-
MBR6040WT
MBR6045WT
Green Products
Max.
0.65
0.55
1.0
150
1400
7.5
10,000
Units
V
V
mA
mA
pF
nH
V/μs
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature Range
Storage Temperature Range
Maximum Thermal
Resistance Junction to Case
Maximum Thermal
Resistance,Case to Heat
Sink
Approximate Weight
Case Style
Symbol
TJ
Tstg
RθJC
Condition
-
-
DC operation
RθCS
Mounting surface, smooth and
greased
wt
-
TO-247AD
Specification
-55 to +150
-55 to +150
1.0(per device)
0.5(per device)
0.24
Units
℃
℃
℃/W
℃/W
6.7
g
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