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74LVC573A View Datasheet(PDF) - Diodes Incorporated.

Part Name
Description
Manufacturer
74LVC573A Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
74LVC573A
Package Characteristics
A
Symbol
θJA
θJC
θJA
θJC
Parameter
Thermal Resistance
Junction-to-Ambient
Thermal Resistance
Junction-to-Case
Thermal Resistance
Junction-to-Ambient
Thermal Resistance
Junction-to-Case
Package
TSSOP-20
TSSOP-20
V-QFN4525-20
V-QFN4525-20
Test Conditions
Min
Typ
Max
Unit
(Note 9)
74
°C/W
(Note 9)
15
°C/W
(Note 9)
67
°C/W
(Note 9)
20
°C/W
Note:
9. Test conditions for TSSOP-20 and V-QFN4525-20: Devices mounted on 4 layer FR-4 substrate PC board, 2oz copper, with minimum recommended
pad layout per JESD 51-7.
74LVC573A
Document number: DS35897 Rev. 2 - 2
6 of 11
www.diodes.com
May 2015
© Diodes Incorporated

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