Reel
www.vishay.com
+ 0.2
1.8 - 0
SFH640
Vishay Semiconductors
23012
+1
16.4 - 0
Fig. 18 - Tape and Reel Shipping Medium
SOLDER PROFILES
IR Reflow Soldering (JEDEC® J-STD-020C compliant)
One time soldering reflow is recommended within the
condition of temperature and time profile shown below. Do
not solder more than three times.
PROFILE ITEM
Preheat
- Temperature minimum (TS min.)
- Temperature maximum (TS max.)
- Time (min. to max.) (tS)
Soldering zone
- Temperature (TL)
- Time (tL)
Peak temperature (Tp)
Ramp-up rate
Ramp-down rate
CONDITIONS
150 °C
200 °C
90 s ± 30 s
217 °C
60 s
260 °C
3 °C/s max.
3 °C/s to 6 °C/s
10000
Axis2T0istle
Ramp-up
Tp (260 °C)
10000
1000
100
TL (217 °C)
TS max. (200 °C)
Ramp-down
1000
60 s
TS min.
tL (soldering)
(150 °C)
100
23016
25
0
602s0to 120 s40
60 35 s to8700 s
tS (preheat) Time (s)
Fig. 19
10
Time (s)
Rev. 1.7, 18-Jun-2019
8
Document Number: 83682
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000