BZV55B10-L0L0G View Datasheet(PDF) - TSC Corporation
Part Name
Description
Manufacturer
BZV55B10-L0L0G Datasheet PDF : 5 Pages
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Small Signal Product
PACKAGE OUTLINE DIMENSIONS
C
B
A
SUGGESTED PAD LATOUT
BZV55B2V4 ~ BZV55B75
Taiwan Semiconductor
DIM.
A
B
C
Unit (mm)
Min
Max
3.30
3.70
1.40
1.60
0.20
0.50
Unit (inch)
Min Max
0.130 0.146
0.055 0.063
0.008 0.020
DIM.
A
B
C
D
Unit(mm)
Typ.
1.25
2.00
2.50
5.00
Unit(inch)
Typ.
0.049
0.079
0.098
0.197
Document Number: DS_S1403001
Version: E14
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