PS7221-2A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of temperature higher than 210 ˚C
• Number of reflows
• Flux
235 ˚C (package surface temperature)
30 seconds or less
Three
Rosin flux containing small amount of chlorine (The flux with a max.
chlorine content of 0.2 Wt % is recommended
Recommended Temperature Profile of Infrared Reflow
100 to 160 ˚C
60 to 120 s
(preheating)
(heating)
to 10 s
to 30 s
235 ˚C (peak temperature)
210 ˚C
(2) Dip soldering
• Temperature
• Time
• Number of times
• Flux
Time (s)
260 ˚C or below (molten solder temperature)
10 seconds or less
One
Rosin flux containing small amount of chlorine (The flux
with a max. chlorine content of 0.2 Wt % is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
• Avoid shorting between portion of frame and leads.
*
*
*: Portion of frame
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
DATA SUBJECT TO CHANGE WITHOUT NOTICE
08/15/2001