ADA4857-1YCPZ-RL View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADA4857-1YCPZ-RL Datasheet PDF : 21 Pages
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ADA4857-1/ADA4857-2
OUTLINE DIMENSIONS
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
1.84
1.74
1.64
5
0.50 BSC
8
TOP VIEW
0.30
0.25
0.20
0.50
0.40
0.30
EXPOSED
PAD
1.55
1.45
1.35
4
1
BOTTOM VIEW
PIN 1
INDICATOR
(R 0.15)
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
Figure 58. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-13)
Dimensions shown in millimeters
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) 1
5
6.20 (0.2441)
4 5.80 (0.2284)
0.25 (0.0098)
0.10 (0.0040)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
COPLANARITY
0.10 SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.27 (0.0500)
0.25 (0.0098) 0.40 (0.0157)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 59. 8-Lead Standard Small Outline Package [SOIC_N]
(R-8)
Dimensions shown in millimeters and (inches)
Data Sheet
Rev. D | Page 20 of 21
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