NCV8403, NCV8403A
TYPICAL PERFORMANCE CURVES
150
150
125
125
100
PCB Cu thickness, 1.0 oz
75
PCB Cu thickness, 2.0 oz
50
25
0 100 200 300 400 500 600 700 800
COPPER HEAT SPREADER AREA (mm2)
Figure 20. RqJA vs. Copper Area − SOT−223
100
75
PCB Cu thickness, 1.0 oz
50
PCB Cu thickness, 2.0 oz
25
0 100 200 300 400 500 600 700 800
COPPER HEAT SPREADER AREA (mm2)
Figure 21. RqJA vs. Copper Area − DPAK
1000
100 50% Duty Cycle
20%
10 10%
5%
1 2%
1%
0.1
0.01 Single Pulse
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
PULSE TIME (sec)
Figure 22. Transient Thermal Resistance − SOT−223 Version
100
50% Duty Cycle
10 20%
10%
5%
1 2%
1%
0.1
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
PULSE TIME (sec)
Figure 23. Transient Thermal Resistance − DPAK Version
http://onsemi.com
7
100
1000
100
1000