ECG015(2006) View Datasheet(PDF) - WJ Communications => Triquint
Part Name
Description
Manufacturer
ECG015 Datasheet PDF : 5 Pages
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ECG015
¼ Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
ECG015B Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“E015G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E015” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
Land Pattern
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1B
Passes at between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Thermal Specifications
Parameter
Rating
MTTF vs. GND Tab Temperature
100000
Operating Case Temperature
Thermal Resistance, Rth (1)
-40 to +85 °C
128 °C / W
10000
Junction Temperature, Tj (2)
149 °C
Notes:
1000
1. The thermal resistance is referenced from the junction-to-
case at a case temperature of 85 °C. Tj is a function of
the voltage and the current applied to pin 3 and can be 100
calculated by:
60
Tj = Tcase + Rth * Vde * Icc
2. This corresponds to the typical biasing condition of +5V,
100 mA at an 85° C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 °C.
70 80 90 100 110 120
Tab Temperature (°C)
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
Page 5 of 5 October 2006
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