TLMB2100(2003) View Datasheet(PDF) - Vishay Semiconductors
Part Name
Description
Manufacturer
TLMB2100 Datasheet PDF : 12 Pages
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VISHAY
following temperature profile means the tempera
ture at the device surface. Since temperature differ
ence occurs between the work and the surface of
the circuit board depending on the pes of circuit
board or reflow furnace, the operating conditions
should be verified prior to start of operation.
• Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
• Use the 6/4 solder or the solder containing silver.
• Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
• Handle products only after the temperature is
cooled off.
Cleaning
• Perform cleaning after soldering strictly in
conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial
use) should be used.
Demineralized or distilled water having a
resistivity of not less than 500 mΩ
corresponding to a conductivity of 2 mS/m.
• Temperature and time: 30 seconds under the
temperature below 50 °C or 3 minutes below 30 °C.
• Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 qC - 4 qC/s
10 s max.
@ 230 qC
120 s - 180 s 90 s max
2 qC - 4 qC/s
50 100 150 200 250 300 350
Time ( s )
16944
TLM.210.
Vishay Semiconductors
Document Number 83199
Rev. A5, 13-Jun-03
www.vishay.com
11
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