DSA6312JL2JB-T View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

DSA6312JL2JB-T

Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum for Automotive

Microchip Technology 

DSA63XX

4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

Dimension Limits

Number of Terminals

N

Terminal Pitch

e

Terminal Pitch

e1

Overall Height

A

Standoff

A1

Substrate Thickness (with Terminals) A3

MILLIMETERS

MIN

NOM

MAX

6

1.55 BSC

0.95 BSC

0.79

0.84

0.89

0.00

0.02

0.05

0.20 REF

Overall Length

Overall Width

Terminal Width

Terminal Width

Terminal Length

D

2.00 BSC

E

1.60 BSC

b1

0.30

0.35

0.40

b2

0.40

0.45

0.50

L

0.50

0.55

0.60

Notes:

Terminal 1 Index Chamfer

CH

-

0.15

-

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated

3. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-1200A Sheet 2 of 2

DS20006189A-page 16

 2019 Microchip Technology Inc.

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