CD14538BMS Ver la hoja de datos (PDF) - Intersil
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CD14538BMS Datasheet PDF : 9 Pages
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CD14538BMS
Typical Performance Characteristics (Continued)
3
2 SUPPLY VOLTAGE (VDD) = 15V
1
10V
0
5V
-1
-2
-3
3
SUPPLY VOLTAGE (VDD) = 5V
2
1
10V
0
-1
5V
-2
-3
-60 -40 -20 0 20 40 60 80 100 120 140
AMBIENT TEMPERATURE (oC)
FIGURE 12. TYPICAL PULSE-WIDTH VARIATION AS A FUNCTION
OF TEMPERATURE (RX = 100 KΩ, CX = 0.1µF)
-60 -40 -20 0 20 40 60 80 100 120 140
AMBIENT TEMPERATURE (oC)
FIGURE 13. TYPICAL PULSE-WIDTH VARIATION AS A FUNCTION
OF TEMPERATURE (RX = 100 KΩ, CX = 2000pF)
6
4
2
1000 8
6
4
2
CL = 50pF, RL = 200KΩ
RX = 100KΩ
AMBIENT TEMPERATURE (TA) =25oC
ONE MONOSTABLE OPERATING
100 8
6
4
2
10 8
6
4
2
18
6
4
2
0.1 8
6
4
2
0.01
2
0.0001
10V
15V
18V
SUPPLY VOLTAGE
(VDD) = 5V
4 68 2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
0.001 0.01
0.1
1
10
100
OUTPUT DUTY CYCLE (%)
FIGURE 14. TYPICAL TOTAL SUPPLY CURRENT AS A FUNC-
TION OF OUTPUT DUTY CYCLE
8
6
RX = 100KΩ
4 TA = +25oC
2
1000
8
6
4
SUPPLY VOLTAGE (VDD) = 15V
2
10V
100
8
6
4
2
10
8
5V
6
4
2
0
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
10
100
1000
10K
100K
CX CAPACITANCE (pfs)
FIGURE 15. TYPICAL TOTAL SUPPLY CURRENT AS A FUNC-
TION OF LOAD CAPACITANCE
Chip Dimension and Pad Layout
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-648
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch)
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