ST72652C4T1 Ver la hoja de datos (PDF) - STMicroelectronics

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ST72652C4T1

LOW-POWER, FULL-SPEED USB 8-BIT MCU WITH 32K FLASH, 5K RAM, FLASH CARD I/F, TIMER, PWM, ADC, I2C, SPI

STMicroelectronics 

ST7265x

EMC CHARACTERISTICS (Cont’d)

True Open Drain Pin Protection

The centralized protection (4) is not involved in the

discharge of the ESD stresses applied to true

open drain pads due to the fact that a P-Buffer and

diode to VDD are not implemented. An additional

local protection between the pad and VSS (5a &

5b) is implemented to completely absorb the posi-

tive ESD discharge.

Multisupply Configuration

When several types of ground (VSS, VSSA, ...) and

power supply (VDD, VDDA, ...) are available for any

reason (better noise immunity...), the structure

shown in Figure 86 is implemented to protect the

device against ESD.

Figure 84. Positive Stress on a True Open Drain Pad vs. VSS

VDD

VDD

Main path

Path to avoid

(1)

OUT

(4)

IN

(5a)

(3b)

(2b)

(5b)

VSS

Figure 85. Negative Stress on a True Open Drain Pad vs. VDD

VDD

Main path

OUT

(4)

IN

(3b)

(3b)

VSS

VDD

(1)

(2b)

(3b)

VSS

Figure 86. Multisupply Configuration

VDD

VSS

VDDA

VDDA

VSS

VSSA

BACK TO BACK DIODE

BETWEEN GROUNDS

VSSA

141/166

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