CXD2498 Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXD2498 Datasheet PDF : 51 Pages
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Package Outline
Unit: mm
CXD2498R
48PIN LQFP (PLASTIC)
9.0 ± 0.2
∗ 7.0 ± 0.1
36
25
S
37
24
48
1
0.5
13
(0.22)
12
+ 0.08
0.18 – 0.03
0.13 M
0.1 ± 0.1
A
B
+ 0.2
1.5 – 0.1
+ 0.05
0.127 – 0.02
0.1 S
0.18 ± 0.03
0˚ to 10˚
DETAIL A
DETAIL B:PALLADIUM
NOTE: Dimension “ ∗” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
LQFP-48P-L01
LQFP048-P-0707
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
PALLADIUM PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.2g
– 51 –
Sony Corporation
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