CXA3219M Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXA3219M Datasheet PDF : 15 Pages
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Package Outline
Unit: mm
16PIN SOP (PLASTIC) 300mil
+ 0.4
9.9 – 0.1
16
9
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
8
1.27
+ 0.1
0.2 – 0.05
CXA3219M
SONY CODE
EIAJ CODE
SOP-16P-L01
∗SOP016-P-0300-A
JEDEC CODE
± 0.12 M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.2g
– 15 –
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