Packaging Information
48C2, 48-Ball, Plastic Chip-size Ball Grid Array
Package (CBGA)
48T, 48-Lead, Plastic Thin Small Outline Package
(TSOP) Dimensions in Millimeters and (Inches)*
JEDEC OUTLINE MO-142 DD
8.2
7.8
4.0
6
54321
A
B
C
11.2
D
5.6
10.8
E
F
G
H
0.85
TYP
0.75
NON-ACCUMULATIVE
0.40 DIA TYP
0.35
1.2 MAX
48U, 48-Ball, Micro Ball Grid Array Package (µBGA)
*Controlling dimension: millimeters
6.8
6.4
3.75
F
E D C BA
1
2
3
4
8.4
8.0 5
6
7
8
5.25
0.75 TYP
NON-ACCUMULATIVE
0.30 DIA TYP
1.00
0.85
0.15 MIN.
0.70
18
AT49BV16X4(T)