NXP Semiconductors
SC18IS600
SPI to I2C-bus interface
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 27. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
12. Abbreviations
Table 18. Abbreviations
Acronym
Description
ASCII
American Standard Code for Information Interchange
CPU
Central Processing Unit
GPIO
General Purpose Input/Output
I/O
Input/Output
I2C-bus
Inter-Integrated Circuit bus
LSB
Least Significant Bit
MSB
Most Significant Bit
PCB
Printed-Circuit Board
SPI
Serial Peripheral Interface
UART
Universal Asynchronous Receiver/Transmitter
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 20 November 2017
© NXP Semiconductors N.V. 2017. All rights reserved.
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