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MAX6622UE9A Ver la hoja de datos (PDF) - Maxim Integrated

Número de pieza
componentes Descripción
Fabricante
MAX6622UE9A
MaximIC
Maxim Integrated 
MAX6622UE9A Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
5-Channel Precision Temperature Monitor
ABSOLUTE MAXIMUM RATINGS
VCC, SMBCLK, SMBDATA, ALERT, OVERT,
STBY to GND .......................................................-0.3V to +6V
DXP_ to GND..............................................-0.3V to (VCC + 0.3V)
DXN2, DXN3, DXN4 to GND .................................-0.3V to +0.8V
SMBDATA, ALERT, OVERT Current....................-1mA to +50mA
DXN Current .......................................................................±1mA
Continuous Power Dissipation (TA = +70°C)
16-Pin TSSOP
(derate 11.1mW/°C above +70°C)..............................888.9mW
Junction-to-Case Thermal Resistance (θJC) (Note A)
16-Pin TSSOP ..............................................................27°C/W
Junction-to-Ambient Thermal Resistance (θJA) (Note A)
16-Pin TSSOP...............................................................90°C/W
ESD Protection (all pins, Human Body Model) ................±2000V
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note A: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
4-layer board. For detailed information on package thermal considerations, refer to Application Note 4083 available
at www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +5.5V, VSTBY = VCC, TA = -40°C to +125°C, unless otherwise noted. Typical values are at VCC = +3.3V and
TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Supply Voltage
Software Standby Supply Current
Operating Current
Temperature Resolution
VCC
ISS
SMBus static
ICC
During conversion
Channel 1 only
Other diode channels
3.0
5.5
V
30
µA
500 1000
µA
11
Bits
8
Remote Temperature Accuracy
Local Temperature Accuracy
VCC = 3.3V
TA = TRJ = +60°C to +100°C
TA = TRJ = 0°C to +125°C
-1.0
-3.0
VCC = 3.3V
TA = +60°C to +100°C
TA = 0°C to +125°C
-4.4
-6.1
+1.0
oC
+3.0
-0.4
oC
-0.1
Supply Sensitivity of Temperature
Accuracy
±0.2
oC/V
Remote Channel 1 Conversion
Time
tCONV1
Resistance cancellation off
Resistance cancellation on
95
125 156
ms
190
250
312
Remote Channels 2 Through 4
Conversion Time
tCONV_
95
125 156
ms
Remote-Diode Source Current
High level
IRJ
Low level
80
100 120
µA
8
10
12
Undervoltage-Lockout Threshold
Undervoltage-Lockout Hysteresis
UVLO Falling edge of VCC disables ADC
2.30 2.80 2.95
V
90
mV
Power-On-Reset (POR) Threshold
POR Threshold Hysteresis
ALERT, OVERT
VCC falling edge
1.2
2.0
2.5
V
90
mV
Output Low Voltage
Output Leakage Current
VOL
ISINK = 1mA
ISINK = 6mA
0.3
V
0.5
1
µA
2 _______________________________________________________________________________________

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