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AD8351-EVALZ Ver la hoja de datos (PDF) - Analog Devices

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AD8351-EVALZ Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
Data Sheet
AD8351
OUTLINE DIMENSIONS
3.10
3.00
2.90
3.10
3.00
2.90
10
6
5.15
4.90
4.65
1
5
PIN 1
IDENTIFIER
0.50 BSC
0.95
15° MAX
0.85
1.10 MAX
0.75
0.15
0.05
COPLANARITY
0.30
0.15
0.23
0.13
0.70
0.55
0.40
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 51. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.32
0.25
0.20
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
(0.30)
1.80
1.70 SQ
1.60
0.50
0.40
0.30
9
8
4
5
BOTTOM VIEW
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-2.
Figure 52. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-35)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD8351ARM
AD8351ARM-REEL7
AD8351ARMZ
AD8351ARMZ-REEL7
AD8351ACPZ-R7
AD8351-EVALZ
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
10-Lead Mini Small Outline Package [MSOP]
10-Lead Mini Small Outline Package [MSOP]
10-Lead Mini Small Outline Package [MSOP]
10-Lead Mini Small Outline Package [MSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Evaluation Board
1 Z = RoHS Compliant Part.
Package Option
RM-10
RM-10
RM-10
RM-10
CP-16-35
Branding
JDA
JDA
#JDA
#JDA
Q20
©2003–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03145-0-1/15(D)
Rev. D | Page 19 of 19

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